Thermal Management Techniques for High-Performance Electronic Devices

  • Authors

    • Peter Wilson Senior Business Analyst, IBM, USA Author

    DOI:

    https://doi.org/10.67228/30716357/IJMRSE-2023PII5V2K

    Published 10-03-2023

  • Thermal Management, Heat Dissipation, Electronic Cooling, Heat Sink, Liquid Cooling, Heat Pipe, Vapor Chamber, Thermal Interface Materials, High-Performance Electronics, Semiconductor Cooling, Thermal Resistance, Nanofluid Cooling, CFD Analysis, Power Electronics, Thermal Reliability

    Issue

    Vol. 6 No. 2 (2023)

    Section

    Articles

    How to Cite

    Thermal Management Techniques for High-Performance Electronic Devices. (2023). International Journal of Modern Research in Science & Engineering, 6(2), 01-16. https://doi.org/10.67228/30716357/IJMRSE-2023PII5V2K

  • Abstract

    Efficient thermal management has become essential for modern high-performance electronic devices due to increasing heat generation in microprocessors, GPUs, power electronics, electric vehicles, and communication systems. Traditional cooling methods are often insufficient for compact and high-power systems, leading to the development of advanced techniques such as liquid cooling, heat pipes, vapor chambers, thermoelectric cooling, phase-change materials, and nanofluid-based systems. Modern thermal management focuses on improving heat dissipation, reducing thermal resistance, enhancing reliability, and maintaining temperature uniformity. Advanced materials, nanotechnology, and computational modelling techniques like CFD and FEA further improve cooling efficiency. Studies show that hybrid cooling systems combining passive and active methods provide superior thermal performance for next-generation electronic devices.

  • References

    [1] A. Bar-Cohen and P. Wang, “On-chip hot spot remediation with miniature thermoelectric coolers,” Microelectronics Journal, vol. 43, no. 3, pp. 154–163, 2012.

    [2] S. V. Garimella, “Advances in mesoscale thermal management technologies for microelectronics,” Microelectronics Journal, vol. 37, no. 11, pp. 1165–1185, 2006.

    [3] D. B. Tuckerman and R. F. W. Pease, “High-performance heat sinking for VLSI,” IEEE Electron Device Letters, vol. 2, no. 5, pp. 126–129, 1981.

    [4] A. Shojaeian and A. Kosar, “Convective heat transfer enhancement in electronic cooling systems,” Applied Thermal Engineering, vol. 89, pp. 1001–1012, 2015.

    [5] J. R. Culham and M. M. Yovanovich, “Thermal modeling of heat sinks and heat spreaders,” IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 2, pp. 78–85, 2001.

    [6] S. G. Kandlikar, “High flux heat removal with microchannels—A roadmap of challenges and opportunities,” Heat Transfer Engineering, vol. 26, no. 8, pp. 5–14, 2005.

    [7] Y. Xuan and Q. Li, “Heat transfer enhancement of nanofluids,” International Journal of Heat and Fluid Flow, vol. 21, no. 1, pp. 58–64, 2000.

    [8] S. U. S. Choi, “Enhancing thermal conductivity of fluids with nanoparticles,” in Proceedings of the ASME International Mechanical Engineering Congress and Exposition, San Francisco, CA, USA, 1995, pp. 99–105.

    [9] P. Keblinski, J. A. Eastman, and D. G. Cahill, “Nanofluids for thermal transport,” Materials Today, vol. 8, no. 6, pp. 36–44, 2005.

    [10] D. Reay, R. McGlen, and P. Kew, Heat Pipes: Theory, Design and Applications, 6th ed. Oxford, U.K.: Butterworth-Heinemann, 2014.

    [11] F. Lefèvre and C. Sarraf, “Vapor chamber technology for high-performance electronics cooling,” Applied Thermal Engineering, vol. 50, no. 1, pp. 127–138, 2013.

    [12] K. Vafai, Handbook of Porous Media, 3rd ed. Boca Raton, FL, USA: CRC Press, 2015.

    [13] A. A. Balandin, “Thermal properties of graphene and nanostructured carbon materials,” Nature Materials, vol. 10, no. 8, pp. 569–581, 2011.

    [14] M. M. Farid, A. M. Khudhair, S. A. K. Razack, and S. Al-Hallaj, “A review on phase change energy storage: Materials and applications,” Energy Conversion and Management, vol. 45, no. 9–10, pp. 1597–1615, 2004.

    [15] J. Wei, Y. Li, and X. Zhang, “Artificial intelligence-based thermal management for high-performance electronic systems,” IEEE Access, vol. 8, pp. 129–142, 2020.

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